						Module Specifications 			XSW-640- Samtec 			XSW-640- Analog 			XSW-640- CL 			XSW-640- GigE 			  		
					Lens 		
					Focal length 			Broad selection of lenses available 		
					Optical interface 			Fixation holes for multiple lens mounts 		
					Imaging performance 		
					Maximum frame rate (full frame) 			100 Hz 			25 Hz (PAL) or 30 Hz (NTSC) 			100 Hz 		
					Window of interest 			Minimum size 32 x 4 		
					Integration time range 			1 μs - 40 ms 		
					Noise level: High gain 			120 e- 		
					Noise level: Low gain 			400 e- 		
					Gain level: High gain 			1.28 e-/ADU 		
					Gain level: Low gain 			16.2 e-/ADU 		
					On-board image processing 			Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities 			Up to 4 NUCs, Auto-Gain, Trigger Possibilities 		
					ADC 			14 bit 		
					Interfaces 		
					Digital output 			BT.601-6/BT.656-5 			- 			CameraLink or Xeneth API/SDK 			GigE Vision or Xeneth API/SDK 		
					Analog output 			- 			PAL or NTSC 			- 		
					Module control 			Serial LVCMOS 3 V (XSP) 			RS232 (XSP) 			CameraLink 			GigE Vision 		
					Trigger 			Trigger in or out (configurable) 		
					Power requirements 		
					Power consumption 			+/- 2.6 W 			3 W 			2.8 W 			4 W 		
					Power supply 			12 V 		
					Physical characteristics 		
					Shock 			40 G, 11 ms according to MIL-STD810G 		
					Vibration 			5 G (20 Hz to 2000 Hz) according to MIL-STD883J 		
					Operating case temperature 			-40ºC to 70ºC (industrial components) 		
					Storage temperature range 			-40ºC to 85ºC (industrial components) 		
					Dimensions (W x H x L mmᵌ) 			45 x 45 x 51 			45 x 45 x 55 			45 x 45 x 65 		
					Weight module 			120 g 			145 g 			129 g 			165 g

XSW-640

Array Specifications	XSW-640
Array type	InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Spectral band	0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm)
Resolution	640 x 512
Pixel pitch	20 μm
Readout mode	Integrate Then Read (ITR)	Integrate While Read (IWR)
Peak Quantum Efficiency (QE)	80%	85%
ROIC noise	High gain: 60 e-	Low gain: 400 e-
Sensitivity	High gain: 20 μV/e-	Low gain: 1.6 μV/e-
Dark current	0.8 x 10⁶ e-/s
Integration capacitor	High gain: 6.7 fF	Low gain: 85 fF
Array cooling	TE1-stabilized
Pixel operability	> 99 %

Module Specifications	XSW-640- Samtec	XSW-640- Analog	XSW-640- CL	XSW-640- GigE
Lens
Focal length	Broad selection of lenses available
Optical interface	Fixation holes for multiple lens mounts
Imaging performance
Maximum frame rate (full frame)	100 Hz	25 Hz (PAL) or 30 Hz (NTSC)	100 Hz
Window of interest	Minimum size 32 x 4
Integration time range	1 μs - 40 ms
Noise level: High gain	120 e-
Noise level: Low gain	400 e-
Gain level: High gain	1.28 e-/ADU
Gain level: Low gain	16.2 e-/ADU
On-board image processing	Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities	Up to 4 NUCs, Auto-Gain, Trigger Possibilities
ADC	14 bit
Interfaces
Digital output	BT.601-6/BT.656-5	-	CameraLink or Xeneth API/SDK	GigE Vision or Xeneth API/SDK
Analog output	-	PAL or NTSC	-
Module control	Serial LVCMOS 3 V (XSP)	RS232 (XSP)	CameraLink	GigE Vision
Trigger	Trigger in or out (configurable)
Power requirements
Power consumption	+/- 2.6 W	3 W	2.8 W	4 W
Power supply	12 V
Physical characteristics
Shock	40 G, 11 ms according to MIL-STD810G
Vibration	5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Operating case temperature	-40ºC to 70ºC (industrial components)
Storage temperature range	-40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ)	45 x 45 x 51	45 x 45 x 55	45 x 45 x 65
Weight module	120 g	145 g	129 g	165 g

XSW-640

Array Specifications