Module Specifications XSW-640- Samtec XSW-640- Analog XSW-640- CL XSW-640- GigE  
Focal length Broad selection of lenses available
Optical interface Fixation holes for multiple lens mounts
Imaging performance
Maximum frame rate (full frame) 100 Hz 25 Hz (PAL) or 30 Hz (NTSC) 100 Hz
Window of interest Minimum size 32 x 4
Integration time range 1 μs - 40 ms
Noise level: High gain 120 e-
Noise level: Low gain 400 e-
Gain level: High gain 1.28 e-/ADU
Gain level: Low gain 16.2 e-/ADU
On-board image processing Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities Up to 4 NUCs, Auto-Gain, Trigger Possibilities
ADC 14 bit
Digital output BT.601-6/BT.656-5 - CameraLink or Xeneth API/SDK GigE Vision or Xeneth API/SDK
Analog output - PAL or NTSC -
Module control Serial LVCMOS 3 V (XSP) RS232 (XSP) CameraLink GigE Vision
Trigger Trigger in or out (configurable)
Power requirements
Power consumption +/- 2.6 W 3 W 2.8 W 4 W
Power supply 12 V
Physical characteristics
Shock 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Operating case temperature -40ºC to 70ºC (industrial components)
Storage temperature range -40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65
Weight module 120 g 145 g 129 g 165 g


  • Array Specifications XSW-640  
    Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
    Spectral band 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm)
    Resolution 640 x 512
    Pixel pitch 20 μm
    Readout mode Integrate Then Read (ITR) Integrate While Read (IWR)
    Peak Quantum Efficiency (QE) 80% 85%
    ROIC noise High gain: 60 e- Low gain: 400 e-
    Sensitivity High gain: 20 μV/e- Low gain: 1.6 μV/e-
    Dark current 0.8 x 10⁶ e-/s
    Integration capacitor High gain: 6.7 fF Low gain: 85 fF
    Array cooling TE1-stabilized
    Pixel operability > 99 %