Module Specifications XTM-640-QTE XTM-640-GigE XTM-640-CL XTM-640-Analog
Lens
Optical interface No lens option Fixation holes for multiple lens mounts
Imaging performance
Maximum frame rate (full frame) 50 Hz 25 Hz (PAL) or 30 Hz (NTSC)
Window of interest Minimum size 160 x 120
Integration time range 1 μs - 80 μs
Shutter Full control by serial command
Temperature stabilization No thermoelectric cooling required (TEC-less)
Integration type Rolling shutter
On-board image processing Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE Non-Uniformity Correction, Auto-Offset, Auto-Gain Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE
ADC 16 bit
Interfaces
Digital output BT.601-6/BT.656-5 GigE Vision or Xeneth API/SDK CameraLink or Xeneth API/SDK -
Analog output - PAL or NTSC
Module control Serial LVCMOS 3 V (XSP) GigE Vision CameraLink RS232 (XSP)
Trigger Trigger in or out (configurable)
Power requirements
Power consumption 1.65 W < 4.5 W < 2 W
Power supply 3.3 V 12 V
Physical characteristics
Shock 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Ambient operating temperature range -40ºC to 60ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 36 45 x 45 x 55 45 x 45 x 43 45 x 45 x 50
Weight module 75 g 125 g 84 g 99 g

XTM-640

  • Array Specifications XTM-640  
    Array type Uncooled microbolometer (a-Si)
    Spectral band 8 μm to 14 μm
    Resolution 640 x 480
    Pixel pitch 17 μm
    Thermal sensitivity (NETD) 55 mK @ 30°C with f/1 lens
    Array cooling Uncooled
    Pixel operability > 99.5 %

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